Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E. |
MO-186-C | |
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Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077 |
MO-022-A | |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
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Registration - Plastic Quad Flatpack Family, .050 inch Lead Spacing (Gullwing). Item 11.11-231. |
MO-089-A | |
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Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304. |
MO-123-A | |
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Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331 |
MO-164-A | |
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
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Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10- |
MO-033-B | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122. |
MO-067-B | |
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Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271 |
MO-100-A | |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100. |
MO-006-C | |
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Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. |
MO-043-A | |
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Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249. |
MO-078-A | |
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Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. |
MO-112-B | |
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Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451. |
MO-189-A | |
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Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item |
MO-022-D | |
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Registration - Plastic Small Outline J-Lead (SOJ) .350 Wide Body Family, 28 Pins. Item 11.11-232. |
MO-091-A | |
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Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. |
MO-124-B | |
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Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455 |
MO-165-C | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
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Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283. |
MO-104-A | |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB. |
MO-005-B | |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
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Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224. |
MO-081-A | |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
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Registration - Power PQFP with Heat Slug. Item 11.11-559. |
MO-188-B | |
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Registration - Flatpack Family, 22.86 mm Width, 1.27 Pitch. Variations AA-AB. |
MO-023-C | |
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Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). |
MO-058-B | |
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Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. |
MO-090-B | |
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Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303. |
MO-125-A | |
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Registration - Plastic SO with Heat Slug, 20, 24, 30, 36 leads. Addition of a 44 lead (0.65 mm pitch) Plastic Heat Slug Package. Variations AA-AE. Item 11.11-551. |
MO-166-D | |
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Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507. |
MO-209-A | |
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Registration - Single-In-Line (SIP) Family. Item 11.3-79. |
MO-035-A | |
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Registration - Plastic Quad Flatpack .025 inch Lead Spacing (Gullwing). Item 11.11-285. |
MO-069-B | |
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Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383 |
MO-103-B | |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
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Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle. |
MO-014-C | |
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Registration - Single-In-Line Power Module. Item 11.3-128. |
MO-045-A | |
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Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218. |
MO-080-A | |
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Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 |
MO-114-C | |
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Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440. |
MO-152-C | |
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Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027. |
MO-191-A | |
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Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB. |
MO-024-C | |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
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Registration - Plastic Single Flange-Mounted Header, 5-Lead. Item 11.10-259. |
MO-093-A | |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318. |
MO-126-B | |
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Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344. |
MO-168-A | |
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Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514. |
MO-213-A | Dec 1969 |
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Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM. |
MO-001-F | Jun 1983 |
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Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214. |
MO-059-B | Jan 1987 |
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Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274. |
MO-026-D | Jul 1991 |
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Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
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Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP. |
MO-148-A | Jun 1993 |
Item 11.10-334 Free download. Registration or login required. |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16. |
MO-138-A | Jun 1993 |
Item 11.10-310 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G. |
MO-150-B | Jan 1994 |
Item 11.11-366 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J. |
MO-147-A | Jul 1994 |
Item 11.10-321 Committee(s): JC-11 Free download. Registration or login required. |