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Title	Document #	Date
Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.	MO-020-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207.	MO-055-A
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Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.	MO-087-B
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Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301.	MO-121-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.	MO-160-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.	MO-031-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.	MO-066-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280.	MO-098-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.	MO-131-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.	MO-175-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393	MO-218-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.	MO-101-A
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.	MO-002-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.	MO-041-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.	MO-077-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.	MO-111-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.	MO-185-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.	MO-021-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124	MO-057-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.	MO-088-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.	MO-122-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370.	MO-162-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.	MO-030-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.	MO-068-B
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Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.	MO-099-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.	MO-174-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
RESCINDED - Tape Quad Flatpack Family.	MO-102-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).	MO-004-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.	MO-042-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217.	MO-079-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369.	MO-113-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.	MO-146-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.	MO-186-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077	MO-022-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124.	MO-056-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack Family, .050 inch Lead Spacing (Gullwing). Item 11.11-231.	MO-089-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.	MO-123-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331	MO-164-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.	MO-202-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-	MO-033-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.	MO-067-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271	MO-100-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.	MO-006-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.	MO-043-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.	MO-078-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.	MO-112-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.	MO-189-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item	MO-022-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline J-Lead (SOJ) .350 Wide Body Family, 28 Pins. Item 11.11-232.	MO-091-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.	MO-124-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455	MO-165-C
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064.	MO-032-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.	MO-070-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.	MO-104-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.	MO-135-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.	MO-176-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.	MO-005-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.

Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207.

Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.

Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301.

Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.

Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.

Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.

Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393

RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.

Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.

Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.

Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.

Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.

Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124

Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.

Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.

Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370.

Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.

Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.

Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.

Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.

RESCINDED - Tape Quad Flatpack Family.

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.

Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217.

Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369.

Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.

Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.

Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077

Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124.

Registration - Plastic Quad Flatpack Family, .050 inch Lead Spacing (Gullwing). Item 11.11-231.

Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.

Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331

Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-

Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.

Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271

Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.

Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.

Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.

Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item

Registration - Plastic Small Outline J-Lead (SOJ) .350 Wide Body Family, 28 Pins. Item 11.11-232.

Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.

Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455

Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064.

Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.

Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.

Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.

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