Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426. |
MO-183-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. |
MO-090-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299. |
MO-130-A | |
Committee(s): JC-11 Free download. Registration or login required. |