Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE |
MO-339B | May 2024 |
Item 11-1054 Package Designator: PQFP-N28_I4p0... Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-324A | Aug 2016 |
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270 |
MO-085-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324. |
MO-145-A | |
Committee(s): JC-11 Free download. Registration or login required. |