Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283. |
MO-104-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |