Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA |
MO-307A | Dec 2011 |
Item 11.11-856 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E. |
MO-275-A.01 | Jul 2011 |
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Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers. |
MO-237-G.01 | Apr 2011 |
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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