Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513. |
MO-200-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206. |
MO-088-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J. |
MO-147-A | Jul 1994 |
Item 11.10-321 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. |
MO-124-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400. |
MO-077-D | |
Committee(s): JC-11 Free download. Registration or login required. |