Global Standards for the Microelectronics Industry
Standards & Documents Search
Title![]() |
Document # | Date |
---|---|---|
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY |
MO-357D | Nov 2024 |
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 Free download. Registration or login required. |
||
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-358B | Jun 2024 |
Designator: XBNA-N#_I1p0_... Item No: 14-229 Free download. Registration or login required. |
||
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
||
288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-329I | Nov 2024 |
Designator: PDMA-N288-I0p85-R136p8x5p57Z31p8R2p55x0p6 Item: 14-230 Cross Reference: MO-329, SO-023, GS-010
Patents(): Micron: US7,547,213. Free download. Registration or login required. |
Pages
- « first
- ‹ previous
- …
- 70
- 71
- 72