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Title	Document #	Date
PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-360A	May 2024
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE	MO-216H	Sep 2024
Designator: PBGA-B#[#]_I80... Item: 11-1064 Cross Reference: DR4.5 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357C	Jun 2024
Designator: XBMA-H644_I1p0_R78p0x23p0Z2p6 Item #: 14-228 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-358B	Jun 2024
Designator: XBNA-N#_I1p0_... Item No: 14-229 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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