Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319. |
MO-141-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package |
MO-344B | Aug 2023 |
Designator: PBGA-B#[#]_I0p40... Cross Reference: DR4.18 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA |
MO-322A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |