Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA. |
MO-294-A | Nov 2008 |
Item 11.11-804 Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA. |
MO-222-B.01 | Dec 2010 |
Item 11.11-803, 11.11-842E Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
Committee(s): JC-11 Free download. Registration or login required. |