Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35 |
MO-333A | Aug 2018 |
Item 11.11-952 Free download. Registration or login required. |
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Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package |
MO-328B | Feb 2020 |
Designator: PBGA-B#[#]_I0p75... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679. |
MO-250-A | Nov 2003 |
Free download. Registration or login required. |
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Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303. |
MO-125-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271 |
MO-100-A | |
Committee(s): JC-11 Free download. Registration or login required. |