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Title	Document #	Date
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.	MO-278A	Sep 2006
Item 11.14-092 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787	MO-253-B	Feb 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.	MO-190-D	Jan 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.	MO-062-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

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