Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN. |
MO-263-A | Sep 2005 |
Item 11.11-734 Free download. Registration or login required. |
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Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN. |
MO-262-A | Sep 2005 |
Item 11.11-733 Free download. Registration or login required. |
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Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro. |
MO-279A | Sep 2006 |
Item 11.14-093 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041. |
MO-172-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 12 Pin UFS Card, 0.91 mm Pitch |
MO-320B | Sep 2020 |
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 Free download. Registration or login required. |