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Title	Document #	Date
Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-074-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic CGA Rectangular. Item 11.10-371.	MO-159-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.	MO-146-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.	MO-107-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.	MO-104-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

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