Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B. |
MO-331A | Jun 2018 |
Item 11.11-960 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217. |
MO-079-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 |
MO-057-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
Committee(s): JC-11 Free download. Registration or login required. |