Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511. |
MO-212-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393 |
MO-218-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
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Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch). |
MO-163-B | |
Committee(s): JC-11 |