Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB. |
MO-024-C | |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
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Registration - Plastic Single Flange-Mounted Header, 5-Lead. Item 11.10-259. |
MO-093-A | |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318. |
MO-126-B | |
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Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344. |
MO-168-A | |
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Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278. |
MO-034-C | |
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Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284. |
MO-072-B | |
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Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281. |
MO-106-A | |
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Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
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Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021. |
MO-179-A | |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101. |
MO-006-D | |
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Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147. |
MO-046-B | |
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Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246. |
MO-082-A | |
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Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S. |
MO-116-B | |
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Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459. |
MO-154-C | |
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Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle. |
MO-025-B | |
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Replaced - See MS-027-A. Item 11.11-404S. |
MO-061-A | |
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Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270. |
MO-092-A | |
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Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365. |
MO-128-C | |
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Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029. |
MO-167-C | |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S. |
MO-037-A | |
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Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240. |
MO-071-B | |
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Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272. |
MO-105-A | |
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Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E |
MO-142-D | |
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Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418. |
MO-181-A | |
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Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276 |
MO-016-D | |
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Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242. |
MO-047-B | |
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Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243. |
MO-083-A | |
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Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289. |
MO-117-A | |
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Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498. |
MO-197-B | |
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Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235. |
MO-062-A | |
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Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266. |
MO-095-A | |
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Registration - Power Dual-In-Line Package. Item 11.10-297. |
MO-127-A | |
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Registration - 88 Pin Memory Card. Item 11.14-012. |
MO-171-A | |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
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Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388. |
MO-036-B | |
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Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206. |
MO-074-A | |
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Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449. |
MO-108-C | |
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Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319. |
MO-141-A | |
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Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293. |
MO-015-G | |
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