Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289. |
MO-117-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304. |
MO-123-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E. |
MO-186-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB. |
MO-207N | Jun 2013 |
Item 11.4-846 Free download. Registration or login required. |
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Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581. |
MO-228-A | Mar 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635 |
MO-238-A | Feb 2003 |
Free download. Registration or login required. |
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Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.April 2003 |
MO-201-A | Oct 1997 |
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA. |
MO-301A | May 2010 |
Item 11.11-828 Free download. Registration or login required. |
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Registration - Surface Mount Power Package with fused leads. H-PSOF |
MO-299B | Jan 2015 |
Item 11.11-902 Free download. Registration or login required. |
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Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665. |
MO-149-F | Oct 2003 |
Committee(s): JC-11.11, JC-11.4 Free download. Registration or login required. |
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Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329. |
MO-109-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TapePak´ Molded Carrier Ring Family. Zero Degree Minimum Lead Bend. Item 11.11-328. |
MO-094-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA |
MO-158-D | Apr 2002 |
Patents(): IBM: 4,914,814 Free download. Registration or login required. |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657. |
MO-251-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB. |
MO-243-A | Jul 2003 |
Item 11.11-661 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON |
MO-229F | Aug 2012 |
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590. |
MO-231-A | Aug 2001 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON. |
MO-240C | Aug 2012 |
Item 11.11-860 Free download. Registration or login required. |
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Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA. |
MO-261-A | Jun 2005 |
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Free download. Registration or login required. |
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Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA |
MO-308A | Apr 2012 |
Item 11.11-853 Free download. Registration or login required. |
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Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318. |
MO-122-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403. |
MO-173-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272. |
MO-105-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E |
MO-142-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668. |
MO-249-A | Jan 2004 |
Free download. Registration or login required. |
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Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA. |
MO-195-D | May 2006 |
Item 11.11-704 Free download. Registration or login required. |
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Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA. |
MO-284-A | May 2007 |
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Free download. Registration or login required. |
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Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA. |
MO-298-A | Jun 2009 |
Item 11.11-816 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299. |
MO-130-A | |
Committee(s): JC-11 Free download. Registration or login required. |