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Title	Document #	Date
Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.	MO-086-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metal Enclosure for SSD Devices, E1.S and M.2	MO-348A	Jul 2021
Designator: MMXH-R(##)x36p75Z(##) Item: 11.14-205, Access STP Files for MO-348A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.	MO-108-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.	MO-112-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271	MO-100-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.	MO-125-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package	MO-328B	Feb 2020
Designator: PBGA-B#[#]_I0p75... Item: 11.11-979, Access STP File for MO-328B Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35	MO-333A	Aug 2018
Item 11.11-952 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.35 mm x 0.40 mm Pitch Rectangular Family Package	MO-350A	Nov 2021
Designator: PBGA-B#[#]_I0p35... Item 11-998 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package	MO-352A.01	Mar 2023
Designator: PBGA-B#[#}_I0p4... Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package	MO-246I	Aug 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1024, Access STP Files for MO-246I Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package	MO-342A	Jan 2020
Designator: PBGA-B#[#}_I0p65 Item: 11.11-978, Access STP Files for MO-342A Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package	MO-353A	Aug 2022
Item 11-993 Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package	MO-338A	Sep 2019
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210R	Mar 2023
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family	MO-336A	Nov 2018
Item 11-11.963, Access STP File for MO-336A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276U	Aug 2023
Designator: PBGA-B#[#]I0p5... Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242.	MO-047-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-193G	Feb 2021
Designator: PDSO-G#_I0P##-##... Item 11.11-990 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-345A	Oct 2020
Designator: PDSO-G#_I0P5-##... Item: 11.11-984, Access STP Files for MO-345A Cross Reference: SO-023, GS-010C Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick	MO-178D	Sep 2020
Item 11.10-458 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package	MO-343B	Mar 2022
Designator: PDSO-N2-I#-R#x#Z#-CturET0p04 Item: 11.11-1000, Access STP File for MO-343B Cross Reference: DG4.20 Patents(): Nexperia BV: US8809121 B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package	MO-351A	Jun 2022
PDSO-G10_I1p)... Item 11.11-1005 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.	MO-257-B	May 2005
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205.	MO-048-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Metal Enclosure for SSD Devices, E1.S and M.2

Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Registration - mSATA SSD Assembly. DIM.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271

Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35

Registration - Plastic Bottom Grid Array Ball, 0.35 mm x 0.40 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package

Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242.

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick

Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package

Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package

Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.

Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205.

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