Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
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Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. Committee(s): JC-11 |
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RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
Committee(s): JC-11 |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392). |
MO-019-D | |
Committee(s): JC-11 |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391). |
MO-004-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390). |
MO-003-C | |
Committee(s): JC-11 |
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Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). |
MO-058-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP). |
MO-143-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch). |
MO-163-B | |
Committee(s): JC-11 |
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Replaced - See MS-027-A. Item 11.11-404S. |
MO-061-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
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Replaced - See MS-024-E. |
MO-133-A | Jan 2000 |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular). |
MO-052-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218. |
MO-080-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133. |
MO-054-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS |
MO-305C | Oct 2013 |
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 Free download. Registration or login required. |
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Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621. |
MO-217-B | Nov 2001 |
Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326 |
MO-266C | Jan 2009 |
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 |
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Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA. |
MO-225-C | Aug 2007 |
Item 11.11-761 and 11.11-761(E). Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA. |
MO-285-A | Aug 2007 |
Item 11.11-760 and 11.11-760(E) Free download. Registration or login required. |