Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281. |
MO-106-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA. |
MO-018-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD. |
MO-020-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC. |
MO-021-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item |
MO-022-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 22.86 mm Width, 1.27 Pitch. Variations AA-AB. |
MO-023-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB. |
MO-005-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79. |
MO-002-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99. |
MO-002-C | |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100. |
MO-006-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101. |
MO-006-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249. |
MO-078-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638. |
MO-245-A | Sep 2003 |
Free download. Registration or login required. |
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Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514. |
MO-213-A | Dec 1969 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286. |
MO-087-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch |
MO-303B | Mar 2012 |
Item No. 11.11-857 Free download. Registration or login required. |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055. |
MO-027-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |