Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB. |
MO-024-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027. |
MO-028-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266. |
MO-095-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383 |
MO-103-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. |
MO-043-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293. |
MO-015-G | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276 |
MO-016-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA |
MO-307A | Dec 2011 |
Item 11.11-856 Free download. Registration or login required. |
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Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004. |
MO-068-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA. |
MO-270-B | Jun 2008 |
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Free download. Registration or login required. |
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Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604. |
MO-221-C | Jun 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-282-A | Jan 2007 |
Item 11.14-099 Patents(): STAKTEK: See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers. |
MO-256-F | Jun 2007 |
Item 11.14-108 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA |
MO-313A | Aug 2014 |
Item No. 11-892 Free download. Registration or login required. |
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Registration - Flange Mounted Family Surface Mount (Peripheral Terminals). HR-PSFM-G. |
MO-306A | Feb 2011 |
Item 11.10-449. Free download. Registration or login required. |
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Registration - Flange-Mounted Family Axial Lead .600 inch Pin Circle. Item 11.10-273. |
MO-097-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle. |
MO-025-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle. |
MO-014-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260. |
MO-096-A | |
Committee(s): JC-11 Free download. Registration or login required. |