Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Power Dual-In-Line Package. Item 11.10-297. |
MO-127-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299. |
MO-130-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - TSOP I, 7.62 mm Body. Item 11.11-346. |
MO-132-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E |
MO-142-D | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319. |
MO-141-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP). |
MO-143-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324. |
MO-145-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320. |
MO-146-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440. |
MO-152-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459. |
MO-154-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364. |
MO-155-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Ceramic CGA Rectangular. Item 11.10-371. |
MO-159-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017. |
MO-160-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
