Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055. |
MO-027-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027. |
MO-028-B | |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035 |
MO-029-B | |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033. |
MO-031-D | |
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Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037. |
MO-030-B | |
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Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10- |
MO-033-B | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Single-In-Line (SIP) Family. Item 11.3-79. |
MO-035-A | |
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Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278. |
MO-034-C | |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S. |
MO-037-A | |
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Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388. |
MO-036-B | |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing. |
MO-038-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. |
MO-039-A | |
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Registration - Power Module. Recission of Variation AB. |
MO-040-C | |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101. |
MO-042-A | |
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Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. |
MO-043-A | |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
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Registration - Single-In-Line Power Module. Item 11.3-128. |
MO-045-A | |
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Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147. |
MO-046-B | |
Committee(s): JC-11 Free download. Registration or login required. |