Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390). |
MO-003-C | |
Committee(s): JC-11 |
||
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391). |
MO-004-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392). |
MO-019-D | |
Committee(s): JC-11 |
||
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
Committee(s): JC-11 |
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Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. Committee(s): JC-11 |
||
RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
||
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE |
MO-362A | Nov 2024 |
Designator: SBGA-M16148[49588]_D0p068... Item #: 4-1056
Committee(s): JC-11 Free download. Registration or login required. |
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