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Title	Document #	Date
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.	MO-054-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.	MO-080-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).	MO-052-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-024-E.	MO-133-A	Jan 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-026-C. Item 11.11-483S.	MO-136-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-027-A. Item 11.11-404S.	MO-061-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).	MO-163-B
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.

Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.

Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).

Replaced - See MS-024-E.

Replaced - See MS-026-C. Item 11.11-483S.

Replaced - See MS-027-A. Item 11.11-404S.

Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).

Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

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