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Title	Document #	Date
Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.	MO-107-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.	MO-104-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.	MO-082-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255.	MO-084-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.	MO-134-A	May 1992
Patents(): National Semiconductor: 4,796,080 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224.	MO-081-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369.	MO-113-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.	MO-038-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.	MO-039-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.	MO-037-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.

Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.

Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.

Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255.

Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.

Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224.

Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.

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