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Title	Document #	Date
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH MICROELECTRONIC ASSEMBLY	MO-358A	Sep 2023
Designator: XBNA-N#_I1p0_... Item No: 14-218 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357A	Aug 2023
Designator: XBMA-H644_I1p0_R78p0x23p0Z2p6 Item #: 11.14-219 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE	MO-359A	Sep 2023
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1034 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE	MO-356A	Aug 2023
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-324A	Aug 2016
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270	MO-085-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.	MO-060-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.	MO-145-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.	MO-041-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH MICROELECTRONIC ASSEMBLY

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE

PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE

Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270

Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.

Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.

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