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Title	Document #	Date
Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.	MO-036-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.	MO-038-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.	MO-039-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Module. Recission of Variation AB.	MO-040-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.	MO-041-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.	MO-042-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.	MO-043-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.	MO-044-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Single-In-Line Power Module. Item 11.3-128.	MO-045-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.	MO-046-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.

Registration - Power Module. Recission of Variation AB.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.

Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.

Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.

Registration - Single-In-Line Power Module. Item 11.3-128.

Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.

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