Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Standard Practices and Procedures - Change Record Methodology |
SPP-021A | Jan 2006 |
Item 11.2-710S Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion. |
SPP-006 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Document Procedure. |
SPP-001 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Grid Array Terminal Position Numbering |
SPP-010B | May 2014 |
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Free download. Registration or login required. |
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Standard Practices and Procedures - Gullwing Lead Dimensioning. |
SPP-008 | Sep 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Inactivation and Rescission. |
SPP-016 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Inclusion of Nominal Dimensions. |
SPP-009 | Sep 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points. |
SPP-011 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Lead Finish and base Metal Specification. |
SPP-004 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Measuring Stand-off Heights of Packages |
SPP-019-A | Jul 2001 |
Clarification on how to measure A1.
Item 11.2-595S
Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Metrication. |
SPP-003C | Mar 2006 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors |
SPP-023B | Feb 2013 |
Item 11.11-781(S) Free download. Registration or login required. |
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Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379. |
SPP-014 | Jul 1994 |
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Free download. Registration or login required. |
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Standard Practices and Procedures - Package Variation Designators |
SPP-025C | Aug 2018 |
Item No. 11.2-951(S) Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form. |
SPP-012 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 Mark Function and Location. |
SPP-002 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 orientation for TAB Packages. |
SPP-005 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents. |
SPP-018 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783 |
SPP-024A | Mar 2009 |
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Free download. Registration or login required. |
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Standard Practices and Procedures - Registered and Standard Outlines |
SPP-013A | Oct 2014 |
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 Free download. Registration or login required. |
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