Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors |
SPP-023B | Feb 2013 |
Item 11.11-781(S) Free download. Registration or login required. |
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Standard Practices and Procedures - Grid Array Terminal Position Numbering |
SPP-010B | May 2014 |
Free download. Registration or login required. |
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Standard Practices and Procedures - Registered and Standard Outlines |
SPP-013A | Oct 2014 |
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Package Variation Designators |
SPP-025C | Aug 2018 |
Item No. 11.2-951(S) Committee(s): JC-11.2 Free download. Registration or login required. |
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WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)Status: SupersededAugust 2016 (11.2-924) |
SPP-020A | Jul 2003 |
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 Free download. Registration or login required. |