Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines. |
SPP-015 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009Status: RescindedMarch 2009 |
SPP-017-C | Nov 2004 |
Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S) |
SPP-022B | Mar 2006 |
Free download. Registration or login required. |
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Standard Practices and Procedures - Use of -PROPOSED- on Ballots. |
SPP-007 | |
Committee(s): JC-11 Free download. Registration or login required. |
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WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)Status: SupersededAugust 2016 (11.2-924) |
SPP-020A | Jul 2003 |
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 Free download. Registration or login required. |
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