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Displaying 21 - 25 of 25 documents. Show 5 | 10 | 20 results per page.

Title	Document #	Date
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Grid Array Terminal Position Numbering	SPP-010B	May 2014
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Registered and Standard Outlines	SPP-013A	Oct 2014
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Package Variation Designators	SPP-025C	Aug 2018
Item No. 11.2-951(S) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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