Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard Practices and Procedures - Measuring Stand-off Heights of Packages |
SPP-019-A | Jul 2001 |
Clarification on how to measure A1.
Item 11.2-595S
Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379. |
SPP-014 | Jul 1994 |
Free download. Registration or login required. |
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Standard Practices and Procedures - Gullwing Lead Dimensioning. |
SPP-008 | Sep 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Inclusion of Nominal Dimensions. |
SPP-009 | Sep 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 Mark Function and Location. |
SPP-002 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 orientation for TAB Packages. |
SPP-005 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion. |
SPP-006 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points. |
SPP-011 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form. |
SPP-012 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines. |
SPP-015 | |
Committee(s): JC-11 Free download. Registration or login required. |