Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Standard Practices and Procedures - Package Variation Designators |
SPP-025C | Aug 2018 |
Item No. 11.2-951(S) Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Registered and Standard Outlines |
SPP-013A | Oct 2014 |
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Grid Array Terminal Position Numbering |
SPP-010B | May 2014 |
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Free download. Registration or login required. |
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Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors |
SPP-023B | Feb 2013 |
Item 11.11-781(S) Free download. Registration or login required. |
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Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783 |
SPP-024A | Mar 2009 |
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Free download. Registration or login required. |
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Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S) |
SPP-022B | Mar 2006 |
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Free download. Registration or login required. |
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Standard Practices and Procedures - Metrication. |
SPP-003C | Mar 2006 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Change Record Methodology |
SPP-021A | Jan 2006 |
Item 11.2-710S Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009Status: RescindedMarch 2009 |
SPP-017-C | Nov 2004 |
Committee(s): JC-11.2 Free download. Registration or login required. |
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WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)Status: SupersededAugust 2016 (11.2-924) |
SPP-020A | Jul 2003 |
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 Free download. Registration or login required. |
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