Global Standards for the Microelectronics Industry
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| Title | Document # | Date |
|---|---|---|
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability |
IPC/JEDEC9301-2018 | Dec 2018 |
This document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model. The intent of this document is to help educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data. Committee(s): JC-14.1 Free download. Registration or login required. |
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