Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 2 of 2 documents.
Title | Document # |
Date![]() |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |