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Displaying 1 - 5 of 7 documents. Show 5 results per page.

Title	Document #	Date
Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM	DR-4.50	Nov 2023
BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM Item 2-1038 Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).	DR-4.18A.01	Apr 2021
Item 11.2-965(E) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.14J.01	Feb 2019
Item 11.2-948E Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.27F.01	Nov 2018
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Micropillar Grid Array (MPGA)	DR-4.26B	Nov 2015
Item 11.2-845(R) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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