Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Standard - Thin Matrix Tray for TQFP. |
CS-007-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item |
MO-022-D | |
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Registration - Plastic Small Outline J-Lead (SOJ) .350 Wide Body Family, 28 Pins. Item 11.11-232. |
MO-091-A | |
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Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. |
MO-124-B | |
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Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455 |
MO-165-C | |
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Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S. |
MS-023-A | |
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Registration - Stud Hex Base Family, Flexible Leads. Variations AA-AE. Ref. TO-49, TO-93, TO-94, TO108, TO-118. |
TO-209-A | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
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Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283. |
MO-104-A | |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
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Standard Practices and Procedures - Document Procedure. |
SPP-001 | |
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Registration - Terminal Strip Family Power Module. Variations AA-AB. |
TO-240-B | |
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Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB. |
US-001-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
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Registration - Thick Matrix Tray for BGA. Item 11.5-435. |
CO-028-B | |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB. |
MO-005-B | |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
Committee(s): JC-11 Free download. Registration or login required. |