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Title	Document #	Date
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE	MO-359B	Jul 2024
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-358B	Jun 2024
Designator: XBNA-N#_I1p0_... Item No: 14-229 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR DDR5 SODIMM MICROELECTRONIC ASSEMBLY	CO-037A	Jan 2024
Designator: N/A Item #: 11.5-995 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-361A	Apr 2024
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 JEP95 Registrations Main Page Committee(s): JC-11, JC-11.11 Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR LPDDR5 CAMM2 MODULE	CO-041A	Apr 2024
Item #11.5-1057 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v8-0-0	Feb 2025
This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-4 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v5-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v8-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-1-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-4 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-K101v1-0-0 (Design Rule Kits) JEP30-M101v1-0-0 (ECAD Models Guidelines) JEP30-D10v5-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-360A	May 2024
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC FLANGE MOUNT, THROUGH-HOLE, 2.54 MM PITCH RECT PACKAGE (TRANSISTOR)	TO-282A	Jun 2024
Package Designator: PMDF-T5_I2p54... Item # 11-1058 Patents(): Owners: - Otremba, Ralf - Kasztelan, Christian - Fuergut, Edward - Lee, Teck Sim - Wang, Lee Shuang - Kuek, Hsieh Ting - Murugan, Sanjay Kumar Company: - Infineon Technologies AG, 85579 Neubiberg, DE Patent Number (Germany): - DE 102015109073 B4 Title: - Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-363A	Jul 2024
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2 Connector Performance Standard	PS-007A	Jul 2024
LPDDR5 CAMM2 Connector Performance Standard Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-364A	Aug 2024
Designator:PDFN-N[#]_I1p27... Item #: 11-1063 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR)	TO-283A	Sep 2024
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE	MO-362A	Nov 2024
Designator: SBGA-M16148[49588]_D0p068... Item #: 4-1056 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE	MO-365A	Jan 2025
Designator: PBGA-B#[#]_i0P35... Item: 11-1076 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP)	MO-366A	Feb 2025
Designator: PBGA-B#[#]_I0p35... Item: 11-1075 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements	JEP30-K100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements	JEP30-M100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM	CO-042A	Feb 2025
Designator: N/A Item #: 5-1074 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.

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JEDEC Education Series: Memory, Mobile & Modules