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Title	Document #	Date
Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package	MO-351A	Jun 2022
PDSO-G10_I1p)... Item 11.11-1005 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package	MO-352A.01	Mar 2023
Designator: PBGA-B#[#}_I0p4... Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket	SO-031A	Aug 2022
Item 11.14-209A Designator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package	MO-353A	Aug 2022
Item 11-993 Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE	MO-354B	Sep 2024
Item: 11-1065 Designator: PMSO-E#_I1p14-... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276U	Aug 2023
Designator: PBGA-B#[#]I0p5... Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 262 Pin SODIMM Connector Performance Standard	PS-006B	Sep 2024
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30F	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100B.01	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100G	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100G	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100B.01	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100A.02	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch	MO-355A	Apr 2023
Designator: PQFP-E#_I0p65-R... Item: 11.11-1028 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly	CO-039A	Apr 2023
Designator: N/A Item: 11.5-1004, Access STP File for CO-039A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly	CO-038A	Apr 2023
Designator: N/A Item: 11.5-1001, Access STP File for CO-038A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)	SO-032D	Nov 2024
Designator: SO-032D_PDUtBXC-H736_I1p0-R17p15x78p0Z1p05 Item: 14-231 Cross Reference: N/A Patents(): Patent NO: 9,425,525 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE	MO-356A	Aug 2023
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357D	Nov 2024
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR	CO-040B	Apr 2024
Designator: N/A Item #: 11.5-1041 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package

Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket

Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package

PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

DDR5 262 Pin SODIMM Connector Performance Standard

Part Model Guidelines for Electronic-Device Packages – XML Requirements

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch

Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly

Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly

PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)

PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR

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