Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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PART MODEL SCHEMAS |
JEP30-10v8-0-0 | Feb 2025 |
This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required. |
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Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100A.02 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B.01 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-K100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-M100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Performance Standard - 240 Pin DDR3, UDIMM. Item 11.14-109(S) |
PS-001A | Oct 2007 |
Committee(s): JC-11 Free download. Registration or login required. |
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Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard |
PS-002A | Jul 2015 |
This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR4 connectors in client and server platforms. Committee(s): JC-11.14 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE |
MO-216H | Sep 2024 |
Designator: PBGA-B#[#]_I80... Item: 11-1064
Cross Reference: DR4.5 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE |
MO-365A | Jan 2025 |
Designator: PBGA-B#[#]_i0P35... Item: 11-1076
Committee(s): JC-11 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP) |
MO-366A | Feb 2025 |
Designator: PBGA-B#[#]_I0p35... Item: 11-1075
Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-360A | May 2024 |
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-361A | Apr 2024 |
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-363A | Jul 2024 |
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Free download. Registration or login required. |
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PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-283A | Sep 2024 |
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE |
MO-293C | Jan 2025 |
Item 11-1071 PDFP-_... Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-364A | Aug 2024 |
Designator:PDFN-N[#]_I1p27... Item #: 11-1063
Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE |
MS-012H | Feb 2025 |
Designator: PDSO-G#_I127-##... Item 11-1061 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE |
MS-013H | Feb 2025 |
Designator: PDSO-G#-I1p27... Item 11-1062 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-219D | Apr 2024 |
Free download. Registration or login required. |