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Title	Document #	Date
WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S) Status: SupersededAugust 2016 (11.2-924)	SPP-020A	Jul 2003
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
UFS Card Socket Performance Standard	PS-004A	Jul 2020
For UFS Card 6 Gb/sItem 11.14-195S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Use of -PROPOSED- on Ballots.	SPP-007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)	SPP-022B	Mar 2006
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009 Status: RescindedMarch 2009	SPP-017-C	Nov 2004
Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.	SPP-015
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Registered and Standard Outlines	SPP-013A	Oct 2014
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.	SPP-018
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 orientation for TAB Packages.	SPP-005
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark Function and Location.	SPP-002
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.	SPP-012
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Package Variation Designators	SPP-025C	Aug 2018
Item No. 11.2-951(S) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.	SPP-014	Jul 1994
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Metrication.	SPP-003C	Mar 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Measuring Stand-off Heights of Packages	SPP-019-A	Jul 2001
Clarification on how to measure A1. Item 11.2-595S Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Lead Finish and base Metal Specification.	SPP-004
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.	SPP-011
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Inclusion of Nominal Dimensions.	SPP-009	Sep 1991
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Inactivation and Rescission.	SPP-016
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Gullwing Lead Dimensioning.	SPP-008	Sep 1991
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Grid Array Terminal Position Numbering	SPP-010B	May 2014
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Document Procedure.	SPP-001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.	SPP-006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Change Record Methodology	SPP-021A	Jan 2006
Item 11.2-710S Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S.	CS-008-A	Mar 1996
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519.	CS-005-B	Nov 1998
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S	MS-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Matrix Tray for TQFP.	CS-007-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Matrix Tray for MQFP Shipping. Item 11.5-436S	CS-004-B	Apr 1996
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Matrix Tray for Handling and Shipping PLCC Packages. Variations AA-AL. Item 11.5-312.	CS-003-B	Apr 1993
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311.	CS-002-A	Mar 1993
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB.	US-001-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.	TS-005-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.	MS-018-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - SMT DDR3 DIMM Socket Coplanarity Measurement Gauge. Item 11.14-124.	GS-009A	Jan 2009
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - SMT DDR2 DIMM Socket, Coplanarity Measurement Gauge. Item 11.14-102.	GS-006-A	Jun 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S	MS-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.	MS-014-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.	MS-015-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.	MS-023-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.	TS-001-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family	MS-013G	Oct 2020
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package	MS-012G.02	Sep 2020
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.	MS-011-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.	MS-010-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.	MS-016-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Tape Automated Bonding (TAB) Tape Carrier Family. (Supersedes CO-018). Item 11.11-353S	CS-006-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S	CS-001-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.	MS-022-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.	MS-026-D	Jan 2001
Clarification to note 15 of the Low Profile PQFP registration MS-026 as issue D. Item 11.11-577s Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.	TS-003-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S	TS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.	TS-004-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S	MS-029-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)	GS-004A	Oct 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S	MS-001-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.	MS-021-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)

UFS Card Socket Performance Standard

Standard Practices and Procedures - Use of -PROPOSED- on Ballots.

Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)

Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009

Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.

Standard Practices and Procedures - Registered and Standard Outlines

Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783

Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.

Standard Practices and Procedures - Pin #1 orientation for TAB Packages.

Standard Practices and Procedures - Pin #1 Mark Function and Location.

Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.

Standard Practices and Procedures - Package Variation Designators

Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.

Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors

Standard Practices and Procedures - Metrication.

Standard Practices and Procedures - Measuring Stand-off Heights of Packages

Standard Practices and Procedures - Lead Finish and base Metal Specification.

Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.

Standard Practices and Procedures - Inclusion of Nominal Dimensions.

Standard Practices and Procedures - Inactivation and Rescission.

Standard Practices and Procedures - Gullwing Lead Dimensioning.

Standard Practices and Procedures - Grid Array Terminal Position Numbering

Standard Practices and Procedures - Document Procedure.

Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.

Standard Practices and Procedures - Change Record Methodology

Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S.

Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519.

Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S

Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

Standard - Thin Matrix Tray for TQFP.

Standard - Thin Matrix Tray for MQFP Shipping. Item 11.5-436S

Standard - Thin Matrix Tray for Handling and Shipping PLCC Packages. Variations AA-AL. Item 11.5-312.

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311.

Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB.

Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.

Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.

Standard - SMT DDR3 DIMM Socket Coplanarity Measurement Gauge. Item 11.14-124.

Standard - SMT DDR2 DIMM Socket, Coplanarity Measurement Gauge. Item 11.14-102.

Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S

Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.

Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.

Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family

Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package

Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.

Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.

Standard - Metric Tape Automated Bonding (TAB) Tape Carrier Family. (Supersedes CO-018). Item 11.11-353S

Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S

Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.

Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.

Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.

Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S

Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.

Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S

STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)

Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.

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