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Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2

Item: 11.14-233, Access STP Files for SO-023C

Cross Reference: MO-329, GS-010C

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Committee(s): JC-11, JC-11.14

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A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11

This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E

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Committee(s): JC-11.14

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Designator:  XBNA-N#_I1p0_...

Item No:  14-229

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Committee(s): JC-11, JC-11.14

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Item 102-1029S

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Committee(s): JC-11, JC-11.2

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Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5)

Item 11.2-969E. Editorial Change

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Committee(s): JC-11.2

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BALL GRID ARRAY PACKAGE
BALL PITCH ≤ 0.80 MM
BODY SIZES ≤ 21 MM

Item 2-1038

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Committee(s): JC-11.2

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This outline has been replaced by Design Registration 4.5J and Design Registration 4.27C.

Item 11.2-838(S), 11-893R, 11-894R

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Committee(s): JC-11, JC-11.2

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Item 11.2-839(R)

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Committee(s): JC-11, JC-11.2

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Item 11.2-539S

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Committee(s): JC-11

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Committee(s): JC-11, JC-11.2

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Item 11.2-713(s)

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Committee(s): JC-11, JC-11.2

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Item 11.2-728(S)

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Committee(s): JC-11, JC-11.2

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Item 11.2-765(s)

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Committee(s): JC-11.2

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Item 11.2-820(S)

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Committee(s): JC-11, JC-11.2

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Item 11.2-965(E)

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Committee(s): JC-11, JC-11.2

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This publication is a compilation of some 1800 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers and package interface BGA outlines in both inch and metric versions.

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Committee(s): JC-11

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LPDDR5 CAMM2 Connector Performance Standard

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Committee(s): JC-11, JC-11.14

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11, JC-11.2, JC-14.4

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11, JC-11.2

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This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:

• JEP30-A101v2-0-4 (Assembly Process),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-E101v5-0-0 (Electrical),
  
  • Committees: JC-11, JC-11.2, JC-16
• JEP30-P101v8-0-0 (Package),
  
  • Committees: JC-11, JC-11.2
• JEP30-S101v1-1-1 (Supply Chain),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-T101v2-0-4 (Thermal)
  
  • Committees: JC-11, JC-11.2, JC-15
• JEP30-K101v1-0-0 (Design Rule Kits)
   
• JEP30-M101v1-0-0 (ECAD Models Guidelines)
   
• JEP30-D10v5-0-0 (Types Dictionary)
  
  • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11, JC-11.2, JC-15

Free download. Registration or login required.

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model.

For more information visit the main JEP30 webpage.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11, JC-11.2

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This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR4 connectors in client and server platforms.

A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office.

Committee(s): JC-11.14

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Designator: PBGA-B#[#]_i0P35...

Item: 11-1076 

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Committee(s): JC-11

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Item #11-1048A

Package Designator: PBGA-B#[#] I0p5...

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Committee(s): JC-11, JC-11.11

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Designator: PBGA-B#[#]_I0p5...

Item #: 11-1066

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Committee(s): JC-11, JC-11.11

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Item 11-1071

PDFP-_...

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Committee(s): JC-11, JC-11.11

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Designator: PDSO-G#_I127-##...

Item 11-1061

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Committee(s): JC-11, JC-11.11

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