Standards & Documents Search

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Title	Document #	Date
SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM	CO-042A	Feb 2025
Designator: N/A Item #: 5-1074 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET	SO-023E	Feb 2025
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-233, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C Patents(): CN 202759077 U Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY	DG-4.10E	Feb 2025
Item 102-1029S Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v8-0-0	Feb 2025
This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-4 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v5-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v8-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-1-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-4 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-K101v1-0-0 (Design Rule Kits) JEP30-M101v1-0-0 (ECAD Models Guidelines) JEP30-D10v5-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100B.01	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100G	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30F	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements	JEP30-M100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements	JEP30-K100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100A.02	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100G	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100B.01	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Descriptive Designation System for Electronic-device Packages and Footprints	JESD30O	Feb 2025
This standard establishes requirements for the generation of electronic-device package designators for JEDEC. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE	MS-012H	Feb 2025
Designator: PDSO-G#_I127-##... Item 11-1061 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP)	MO-366A	Feb 2025
Designator: PBGA-B#[#]_I0p35... Item: 11-1075 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE	MS-013H	Feb 2025
Designator: PDSO-G#-I1p27... Item 11-1062 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE	MO-203E	Jan 2025
Item 11-1072 Package Designator: PDSO-G#_... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE	MO-293C	Jan 2025
Item 11-1071 PDFP-_... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE	MO-365A	Jan 2025
Designator: PBGA-B#[#]_i0P35... Item: 11-1076 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357D	Nov 2024
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)	SO-032D	Nov 2024
Designator: SO-032D_PDUtBXC-H736_I1p0-R17p15x78p0Z1p05 Item: 14-231 Cross Reference: N/A Patents(): Patent NO: 9,425,525 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-329I	Nov 2024
Designator: PDMA-N288-I0p85-R136p8x5p57Z31p8R2p55x0p6 Item: 14-230 Cross Reference: MO-329, SO-023, GS-010 Patents(): Micron: US7,547,213. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE	MO-362A	Nov 2024
Designator: SBGA-M16148[49588]_D0p068... Item #: 4-1056 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 262 Pin SODIMM Connector Performance Standard	PS-006B	Sep 2024
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR)	TO-236-I	Sep 2024
Item #: 11-1067 Package Designator: PDSO-G3(6)-i0p95.... Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR)	TO-283A	Sep 2024
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE	MO-354B	Sep 2024
Item: 11-1065 Designator: PMSO-E#_I1p14-... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE	MO-216H	Sep 2024
Designator: PBGA-B#[#]_I80... Item: 11-1064 Cross Reference: DR4.5 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE	MO-153I	Aug 2024
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-364A	Aug 2024
Designator:PDFN-N[#]_I1p27... Item #: 11-1063 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2 Connector Performance Standard	PS-007A	Jul 2024
LPDDR5 CAMM2 Connector Performance Standard Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-363A	Jul 2024
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE	MO-359B	Jul 2024
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC FLANGE MOUNT, THROUGH-HOLE, 2.54 MM PITCH RECT PACKAGE (TRANSISTOR)	TO-282A	Jun 2024
Package Designator: PMDF-T5_I2p54... Item # 11-1058 Patents(): Owners: - Otremba, Ralf - Kasztelan, Christian - Fuergut, Edward - Lee, Teck Sim - Wang, Lee Shuang - Kuek, Hsieh Ting - Murugan, Sanjay Kumar Company: - Infineon Technologies AG, 85579 Neubiberg, DE Patent Number (Germany): - DE 102015109073 B4 Title: - Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-358B	Jun 2024
Designator: XBNA-N#_I1p0_... Item No: 14-229 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-360A	May 2024
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE	MO-339B	May 2024
Item 11-1054 Package Designator: PQFP-N28_I4p0... Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-215E	May 2024
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR LPDDR5 CAMM2 MODULE	CO-041A	Apr 2024
Item #11.5-1057 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR	CO-040B	Apr 2024
Designator: N/A Item #: 11.5-1041 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-219D	Apr 2024
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-361A	Apr 2024
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 JEP95 Registrations Main Page Committee(s): JC-11, JC-11.11 Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR DDR5 SODIMM MICROELECTRONIC ASSEMBLY	CO-037A	Jan 2024
Designator: N/A Item #: 11.5-995 Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.	MO-332B	Jan 2024
Package Designator: PMSO-E17_I1p2... Item 11.11-1046, Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE	MO-340D	Dec 2023
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Item: 11-1044 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM	DR-4.50	Nov 2023
BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM Item 2-1038 Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE	MO-356A	Aug 2023
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276U	Aug 2023
Designator: PBGA-B#[#]I0p5... Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344B	Aug 2023
Designator: PBGA-B#[#]_I0p40... Item: 11.11-1035, Access Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341B	Aug 2023
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11-1030 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package	MO-346A.01	Jun 2023
Designator: PQFP-B#[#]_I0p65... Item: 11-981E, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly	CO-038A	Apr 2023
Designator: N/A Item: 11.5-1001, Access STP File for CO-038A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly	CO-039A	Apr 2023
Designator: N/A Item: 11.5-1004, Access STP File for CO-039A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch	MO-355A	Apr 2023
Designator: PQFP-E#_I0p65-R... Item: 11.11-1028 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210R	Mar 2023
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package	MO-352A.01	Mar 2023
Designator: PBGA-B#[#}_I0p4... Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5	PS-005B	Oct 2022
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package	MO-353A	Aug 2022
Item 11-993 Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket	SO-031A	Aug 2022
Item 11.14-209A Designator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

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JEDEC Education Series: Memory, Mobile & Modules

Standards & Documents Search

SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM

288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET

DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY

PART MODEL SCHEMAS

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Guidelines for Electronic-Device Packages – XML Requirements

PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

Descriptive Designation System for Electronic-device Packages and Footprints

PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE

PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP)

PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE

PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE

PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE

PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)

288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY

SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE

DDR5 262 Pin SODIMM Connector Performance Standard

PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR)

PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR)

PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE

PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE

PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE

PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE

LPDDR5 CAMM2 Connector Performance Standard

PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE

PLASTIC FLANGE MOUNT, THROUGH-HOLE, 2.54 MM PITCH RECT PACKAGE (TRANSISTOR)

DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY

PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)

SHIPPING AND HANDLING TRAY FOR LPDDR5 CAMM2 MODULE

SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR

PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)

PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE

SHIPPING AND HANDLING TRAY FOR DDR5 SODIMM MICROELECTRONIC ASSEMBLY

Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.

PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE

Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM

PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package

Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package

Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly

Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly

Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package

STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5

Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package

Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket

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