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Title	Document #	Date
Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly	CO-039A	Apr 2023
Designator: N/A Item: 11.5-1004, Access STP File for CO-039A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly	CO-038A	Apr 2023
Designator: N/A Item: 11.5-1001, Access STP File for CO-038A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch	MO-355A	Apr 2023
Designator: PQFP-E#_I0p65-R... Item: 11.11-1028, Access STP File for MO-355A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210R	Mar 2023
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package	MO-352A.01	Mar 2023
Designator: PBGA-B#[#}_I0p4... Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v2-0-0	Mar 2023
This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-0 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v2-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v2-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-0 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-0 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v2-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276T	Jan 2023
Designator: PBGA-B#[#]I0p5...Item 11-1027Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30J	Nov 2022
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1002. NOTE IF YOU DOWNLOADED THIS DOCUMENT PRIOR TO 12/16/2022 PLEASE DISCARD AND VIEW AGAIN, PREVIOUS VERSION CONTAINED FORMAT ISSUES. Committee(s): JC-11.2 Free download. Registration or login required.
STANDARD - DDR5 262 Pin SODIMM Connector Performance Standard	PS-006A	Oct 2022
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 11.14-214S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5	PS-005B	Oct 2022
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package	MO-349A.01	Aug 2022
Item: 11.4-996EDesignator: SBGA-M7775[23828]_D0p073... Item: 11.4-996Access STP Files for MO-349ACross Reference: DR4.26 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package	MO-246I	Aug 2022
Designator: PBGA-B#[#]_I0p65...Item: 11.11-1024, Access STP Files for MO-246ICross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Flange Mount Rectangular Family	TO-247F	Aug 2022
Item 11.10-460Designator: PMFM K#_I... Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket	SO-031A	Aug 2022
Item 11.14-209ADesignator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package	MO-353A	Aug 2022
Item 11-993Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Small Outline, 1.14 MM pitch, 15.40 MM Body Width, Rectangular Family Package	MO-354A	Aug 2022
Item: 11.11-1023 STP Files for MO-354A Designator: PMSO-E#_I1p14-... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package	MO-351A	Jun 2022
PDSO-G10_I1p)...Item 11.11-1005 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package	MO-343B	Mar 2022
Designator: PDSO-N2-I#-R#x#Z#-CturET0p04 Item: 11.11-1000, Access STP File for MO-343B Cross Reference: DG4.20 Patents(): Nexperia BV: US8809121 B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package	MO-340C	Mar 2022
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Item: 11.11-999, Access STP Files for MO-340 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Connector	SO-025B	Mar 2022
Designator: PDXC-PP2-I8p9-R107p6xp15Z26p0-DD2p95x1p1 Item: 11.14-208, Access STP Files for SO-025B Cross Reference: TBD Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Enclosure Form Factor for Automotive SSD Connector, Board Mount	SO-030A	Feb 2022
Designator: PBCX-K4_... Item: 11.14-211, Access STP Files for SO-030A Cross Reference: MO-348 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Package	MO-337B	Feb 2022
Designator: PDMA-N262-I0p5-R69p6x3p7Z30p15R2p55x02p35 Item: 11.14-207, Access STP Files for MO-337B Cross Reference: SO-024 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly	MO-329E	Jan 2022
Designator: PDMA-N288-I0p85-R133p8x#p#7Z31p8R2p55x0p6 Item: 11.14-212, Access STP Files for MO-329E Cross Reference: MO-329, SO-023, GS-010 Patents(): Micron: US7,547,213. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Enclosure Form Factor for Automotive SSD Connector, Cable Mount	SO-029A	Jan 2022
Designator: PBXC-K4_D#p##-MR36p05x14p5Z10p25-HS Item: 11.14-210, Access STP Files for SO-029A Cross Reference: MO-348 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.35 mm x 0.40 mm Pitch Rectangular Family Package	MO-350A	Nov 2021
Designator: PBGA-B#[#]_I0p35...Item 11-998 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for DDR5 DIMM Microelectronic Assembly	CO-036B	Oct 2021
Designator: N/A Item: 11.5-997, Access STP Files for CO-036B Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Battery Cell R/A T/H Type Connector, 1.2 mm Pitch	SO-026A	Oct 2021
Designator: PSXC-P6_I1p2-R11p6x5p85Z2p0-R0p3x0p31H1p16 Item: 11.14-198, Access STP Files for SO-026A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Battery Cell R/A SMT Type Connector, 1.2 mm Pitch	SO-028A	Oct 2021
Designator: PSXC-L6_I1p2-R11p6x5p85Z2p07-R0p3x0p6ET0p07 Item: 11.14-198, Access STP Files for SO-028A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Battery Cell Wire Side Connector, 1.2 mm pitch	SO-027A	Sep 2021
Designator: PBXC-q6_i1P2-r7P9X4P25z1P58Item: 11.14-199, Access STP Files for SO-027ACross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.	MO-293B	Sep 2021
Item 11.10-459 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metal Enclosure for SSD Devices, E1.S and M.2	MO-348A	Jul 2021
Designator: MMXH-R(##)x36p75Z(##) Item: 11.14-205, Access STP Files for MO-348A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly	MO-335A	Apr 2021
Designator: PDMA-N84-I0p6-R85p13xY#Z#R1p98x0p43 Item: 11.14-191, Access STP Files for MO-335A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).	DR-4.18A.01	Apr 2021
Item 11.2-965(E) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly	MO-347A	Mar 2021
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A Patents(): Kioxia: 1705380 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-193G	Feb 2021
Designator: PDSO-G#_I0P##-##... Item 11.11-990 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package	MO-216G	Jan 2021
Designator: PBGA-B#[#]_I80... Item: 11.11-989, Access STP File for MO-216G Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package	TO-220L.01	Nov 2020
Item 11.10-456(E) Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package	MO-346A	Nov 2020
Designator: PQFP-B#[#]_I0p65... Item: 11.11-981, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family	MS-013G	Oct 2020
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-345A	Oct 2020
Designator: PDSO-G#_I0P5-##... Item: 11.11-984, Access STP Files for MO-345A Cross Reference: SO-023, GS-010C Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package	MS-012G.02	Sep 2020
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick	MO-178D	Sep 2020
Item 11.10-458 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320B	Sep 2020
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE	SO-023C	Sep 2020
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-202, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C Patents(): CN 202759077 U Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344A	Aug 2020
Designator: PBGA-B#[#]_I0p40... Item: 11.11-976, Access STP File for MO-344A Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
UFS Card Socket Performance Standard	PS-004A	Jul 2020
For UFS Card 6 Gb/sItem 11.14-195S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package	MO-328B	Feb 2020
Designator: PBGA-B#[#]_I0p75... Item: 11.11-979, Access STP File for MO-328B Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package	MO-342A	Jan 2020
Designator: PBGA-B#[#}_I0p65 Item: 11.11-978, Access STP Files for MO-342A Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341A	Oct 2019
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11.11-959 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 28 Terminal Package	MO-339A	Sep 2019
Item 11-11.975, Access STP File for MO-339A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package	MO-338A	Sep 2019
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin SODIMM, 0.50 mm Pitch Package	MO-337A	Apr 2019
Item 14-192 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly

Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly

Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package

Part Model Guidelines for Electronic-Device Packages – XML Requirements

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements

PART MODEL SCHEMAS

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES

STANDARD - DDR5 262 Pin SODIMM Connector Performance Standard

STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5

Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package

Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package

Registration - Plastic Multi Flange Mount Rectangular Family

Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket

Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package

Registration - Plastic Multi Small Outline, 1.14 MM pitch, 15.40 MM Body Width, Rectangular Family Package

Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package

Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package

Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package

Registration - Plastic Dual Connector

Registration - Enclosure Form Factor for Automotive SSD Connector, Board Mount

Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Package

Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly

Registration - Enclosure Form Factor for Automotive SSD Connector, Cable Mount

Registration - Plastic Bottom Grid Array Ball, 0.35 mm x 0.40 mm Pitch Rectangular Family Package

Registration - Shipping and Handling Tray for DDR5 DIMM Microelectronic Assembly

REGISTRATION - Battery Cell R/A T/H Type Connector, 1.2 mm Pitch

REGISTRATION - Battery Cell R/A SMT Type Connector, 1.2 mm Pitch

Registration - Battery Cell Wire Side Connector, 1.2 mm pitch

Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.

Registration - Metal Enclosure for SSD Devices, E1.S and M.2

Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly

Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).

Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package

Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package

Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package

Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package

Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick

Registration - 12 Pin UFS Card, 0.91 mm Pitch

REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

UFS Card Socket Performance Standard

Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package

Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package

Registration - Plastic Bottom Flatpack 28 Terminal Package

Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package

Registration - 262 Pin SODIMM, 0.50 mm Pitch Package

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