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Title	Document #	Date
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.	MO-006-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.	MO-046-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.	MO-082-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.	MO-116-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.	MO-154-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.	MS-014-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family, 3 Lead, Peripheral Leaded Package. Item 11.10-.	TO-264-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variation AE. Item 118.	DO-200-E
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.	MO-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-027-A. Item 11.11-404S.	MO-061-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.	MO-092-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.	MO-128-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.	MO-167-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Coaxial package Outline. Item 269G.	TO-215-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.	TS-001-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See CS-001. (Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads). Item 11.5-297	CO-017-B
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.	GS-001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.	MO-037-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.	MO-071-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.	MO-105-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E	MO-142-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.	MO-181-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.	MS-003-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Lead Finish and base Metal Specification.	SPP-004
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, .300 inch Row Spacing, 4 Lead. Item 120.	TO-250-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276	MO-016-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242.	MO-047-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.	MO-083-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.	MO-117-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.	MO-197-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.	MS-015-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.	SPP-018
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.	TO-265-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud-Hex Base Family, Solid Terminals. Variations AA-AB. Ref. DO-4, DO-5.	DO-203-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.	MO-062-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.	MO-095-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Dual-In-Line Package. Item 11.10-297.	MO-127-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 88 Pin Memory Card. Item 11.14-012.	MO-171-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S	MS-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud-Mounted Stripline Header Family. Item 270G	TO-216-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S	TS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See CS-006-A. (Metric Tape Automated Bonding (TAB) Tape Carrier Family. Variations AA-AE, BA-BC). Item 11.5-296.	CO-018-A
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Plastic Magazine Family, Coinstack. Variations Variations AA-AC. Item 11.5-339.	CO-021-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.	GS-002
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.	MO-036-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-074-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.	MO-108-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.	MO-141-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.	MS-004-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 orientation for TAB Packages.	SPP-005
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.	MO-015-G
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205.	MO-048-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255.	MO-084-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.	MO-118-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364.	MO-155-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.	MO-196-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.	MS-016-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.	TO-200-J
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Opto Family, Insertion Mount, Peripheral Terminals. Item 11.10-336.	TO-266-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.	MO-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.

Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.

Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.

Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.

Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Registration - Flange-Mounted Header Family, 3 Lead, Peripheral Leaded Package. Item 11.10-.

Registration - Disc Type Family. Variation AE. Item 118.

Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.

Replaced - See MS-027-A. Item 11.11-404S.

Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.

Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.

Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.

Registration - Coaxial package Outline. Item 269G.

Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.

Replaced - See CS-001. (Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads). Item 11.5-297

Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.

Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.

Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.

Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E

Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.

Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.

Standard Practices and Procedures - Lead Finish and base Metal Specification.

Registration - Dual-In-Line (DIP) Family, .300 inch Row Spacing, 4 Lead. Item 120.

Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276

Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242.

Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.

Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.

Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.

Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.

Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.

Registration - Stud-Hex Base Family, Solid Terminals. Variations AA-AB. Ref. DO-4, DO-5.

Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.

Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.

Registration - Power Dual-In-Line Package. Item 11.10-297.

Registration - 88 Pin Memory Card. Item 11.14-012.

Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S

Registration - Stud-Mounted Stripline Header Family. Item 270G

Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S

Replaced - See CS-006-A. (Metric Tape Automated Bonding (TAB) Tape Carrier Family. Variations AA-AE, BA-BC). Item 11.5-296.

Registration - Plastic Magazine Family, Coinstack. Variations Variations AA-AC. Item 11.5-339.

Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.

Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.

Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.

Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.

Standard Practices and Procedures - Pin #1 orientation for TAB Packages.

Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.

Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205.

Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255.

Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.

Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364.

Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.

Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.

Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.

Registration - Opto Family, Insertion Mount, Peripheral Terminals. Item 11.10-336.

Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.

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