Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).Status: RescindedFebruary 2015 |
DR-4.6D.01 | Jul 2012 |
This outline has been replaced by Design Registration 4.5J and Design Registration 4.27C. |
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Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA) |
DG-4.25B | Aug 2016 |
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-896(S) Free download. Registration or login required. |
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Design Requirements - Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP). |
DR-4.22C.02 | Mar 2011 |
Item 11.2-839(R) Free download. Registration or login required. |
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Design Requirements - General Requirements |
DG-4.2 | Jan 1980 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Generic Matrix Tray for Handling and Shipping (Low Stacking Profile for BGA Packages). |
DG-4.9A | Mar 2000 |
Item 11.2-539S Committee(s): JC-11 Free download. Registration or login required. |