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Title	Document #	Date
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
ACCEPTED PRACTICES FOR MAKING MICROELECTRONIC DEVICE THERMAL CHARACTERISTICS TESTS Status: Rescinded	JEB20	Jan 1975
Committee(s): JC-11
ANNUAL UPDATING SERVICE:	JEP95 AUS	Jan 2000
Subscription to this updating service is available from the JEDEC Office. New outlines are shipped to subscribers for insertion into the appropriate sections of Publication No. 95. JEP95 and Updating Service can be ordered through JEDEC at (703)907-7540 or ptanner@jedec.org. Committee(s): JC-11
DDR4 260 Pin SODIMM Connector Performance Standard	PS-003A.01	Jul 2016
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5	PS-005A.01	Aug 2021
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

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