Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
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Free download. Registration or login required. |
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ACCEPTED PRACTICES FOR MAKING MICROELECTRONIC DEVICE THERMAL CHARACTERISTICS TESTSStatus: Rescinded |
JEB20 | Jan 1975 |
Committee(s): JC-11 |
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ANNUAL UPDATING SERVICE: |
JEP95 AUS | Jan 2000 |
Subscription to this updating service is available from the JEDEC Office. New outlines are shipped to subscribers for insertion into the appropriate sections of Publication No. 95. JEP95 and Updating Service can be ordered through JEDEC at (703)907-7540 or ptanner@jedec.org. Committee(s): JC-11 |
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DDR4 260 Pin SODIMM Connector Performance Standard |
PS-003A.01 | Jul 2016 |
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 Free download. Registration or login required. |
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DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES |
JESD30J | Nov 2022 |
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1002. Committee(s): JC-11.2 Free download. Registration or login required. |
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