Standards & Documents Search

Displaying 1 - 5 of 595 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.	MO-038-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-073-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.	MO-107-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Pages